Package structure

A package structure comprising:

• a flexible circuit board defining a bent area and a laminated area and comprising:
• a first dielectric layer;
• a first conductive pattern located at a side of the first dielectric layer, comprising a connection terminal located at an end of the bent area away from the laminated area;
• a bearing layer located at a side of the first dielectric layer opposite to the first conductive pattern, corresponding to the laminated area;
• and
• a first built-up structure located on the first conductive pattern and corresponding to the laminated area, the first built-up structure comprising a second dielectric layer and a second conductive pattern electrically connected with the first conductive pattern via first conductive holes in the second dielectric layer;
• a second built-up structure located on the bearing layer and corresponding to the laminated area, the second built-up structure comprising a third dielectric layer and a third conductive pattern electrically connected with the first conductive pattern via second conductive holes in the third dielectric layer;
• wherein the second dielectric layer, the third dielectric layer, the second conductive pattern, and the third conductive pattern correspond only to the laminated area;
• and
• a first solder resist layer covering on the second conductive pattern and defining a plurality of openings, a portion of the second conductive pattern exposing from the openings defining a plurality of first pads.