Semiconductor package structure and method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChin-Cheng KUO, Pao-Nan LEE, Chih-Pin HUNG, Ying-Te OU
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Abstract
The present disclosure relates to a semiconductor package structure and a method of manufacturing the same. The semiconductor package structure includes a semiconductor substrate having a first surface and a second surface opposite the first surface. The semiconductor substrate has a space extending from the second surface to the first surface and an insulation body is disposed in the space. The semiconductor package structure includes conductive posts in the insulation body.
Claims22
A semiconductor device package, comprising:
- a semiconductor substrate having a first surface and a second surface opposite the first surface, the semiconductor substrate defining a space extending from the second surface to the first surface and comprising an insulation body in the space;
- and
- a plurality of solid conductive posts in the insulation body.
A semiconductor device package, comprising:
- a semiconductor substrate having a first surface and a second surface opposite the first surface;
- a first solid conductive post having a first portion between the first surface and the second surface;
- a second solid conductive post having a first portion between the first surface and the second surface;
- and
- an insulation layer over the first surface of the semiconductor substrate, separating the first portion of the first solid conductive post from the first portion of the second solid conductive post.
-20. (canceled)
Dependencies are inferred from the claim text.