Encapsulated Instrumented Substrate Apparatus for Acquiring Measurement Parameters in High Temperature Process Applications

An apparatus comprising:

• a substrate assembly including a bottom substrate and a top coating layer;
• an electronic assembly;
• a nested enclosure assembly including an outer enclosure and an inner enclosure, wherein the outer enclosure encloses the inner enclosure, wherein the inner enclosure encloses at least the electronic assembly;
• an insulating medium disposed within a cavity between the outer surface of the inner enclosure and the inner surface of the outer enclosure;
• and
• a sensor assembly communicatively coupled to the electronic assembly, wherein the sensor assembly includes one or more sensors, the one or more sensors disposed on the bottom substrate of the substrate assembly at one or more locations across the bottom substrate, wherein the top coating layer at least coats the one or more sensors disposed on the bottom substrate, wherein the one or more sensors are configured to acquire one or more measurement parameters at the one or more locations across the substrate assembly, wherein the electronic assembly is configured to receive the one or more measurement parameters from the one or more sensors.

A method comprising:

• acquiring a set of measurement parameters with one or more sensors distributed at one or more locations of a substrate assembly;
• storing the set of measurement parameters in an electronic assembly disposed within an nested enclosure assembly;
• and
• calculating a value for each of the measurement.