US 2017/0365389 A1 · COIL-INCORPORATED MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

Abstract

A coil-incorporated multilayer substrate includes base materials and a coil portion including conductor patterns that are wound a plurality of times on at least one of the base materials, and, in a predetermined direction along the surface of the base material of the coil portion, the width of outermost conductor patterns is larger than the widths of the conductor patterns between an innermost conductor pattern and an outermost conductor pattern, the width of the innermost conductor pattern is larger than the widths of the conductor patterns between the outermost conductor pattern and the innermost conductor pattern, and the width of the innermost conductor pattern is larger than the distance between the innermost conductor pattern and the conductor pattern adjacent to the innermost conductor pattern.

Claims19

Dependent claims

A coil-incorporated multilayer substrate comprising:

a conductor pattern made of metal foil;
a base material made of thermoplastic resin and including the conductor pattern;
and
a coil configured by a plurality of conductor patterns by stacking a plurality of base materials;
wherein
the coil includes a coil axis in a stacking direction in which the plurality of base materials are stacked;
the coil includes a coil portion defined by the plurality of conductor patterns that are shaped so as to be wound around the coil axis a plurality of times;
at least one of the plurality of base materials includes the coil portion;
on the at least one of the plurality of base materials on which the coil portion is provided, an outermost conductor pattern and an innermost conductor pattern are provided;
and
in at least two perpendicular or substantially perpendicular axial directions along a surface of the at least one of the plurality of base materials, of the plurality of conductor patterns that define the coil portion:
a width of the outermost conductor pattern is larger than a width of the conductor patterns between the innermost conductor pattern and the outermost conductor pattern;
a width of the innermost conductor pattern is larger than the width of the conductor patterns between the outermost conductor pattern and the innermost conductor pattern;
and
the width of the innermost conductor pattern is larger than or equal to a distance between the innermost conductor pattern and the conductor pattern adjacent to the innermost conductor pattern.

12 more elements

A coil-incorporated multilayer substrate comprising:

a conductor pattern made of metal foil;
a base material made of thermoplastic resin and including the conductor pattern;
and
a coil configured by a plurality of conductor patterns by stacking a plurality of base materials;
wherein
the coil includes a coil axis in a stacking direction in which the plurality of base materials are stacked;
the coil includes a coil portion defined by the plurality of conductor patterns that are shaped so as to be wound around the coil axis a plurality of times;
at least one of the plurality of base materials includes the coil portion;
on the at least one of the plurality of base materials on which the coil portion is provided, an outer dummy pattern defined by a conductor pattern on an outer side of the coil portion, and an inner dummy pattern defined by a conductor pattern on an inner side of the coil portion are provided;
and
in at least two perpendicular or substantially perpendicular axial directions along a surface of the at least one of the plurality of base materials, of the plurality of conductor patterns that define the coil portion:
a width of the outer dummy pattern is larger than a width of the conductor patterns of the coil portion;
a width of the inner dummy pattern is larger than the width of the conductor patterns of the coil portion;
a distance between the outer dummy pattern and the conductor pattern of the coil portion adjacent to the outer dummy pattern is smaller than or equal to a distance between the conductor patterns of the coil portion;
and
a distance between the inner dummy pattern and the conductor pattern of the coil portion adjacent to the inner dummy pattern is smaller than or equal to the width of the inner dummy pattern.

13 more elements

A coil-incorporated multilayer substrate comprising:

a conductor pattern made of metal foil;
a base material made of thermoplastic resin and including the conductor pattern;
and
a coil configured by a plurality of conductor patterns by stacking a plurality of base materials;
wherein
the coil includes a coil axis in a stacking direction in which the plurality of base materials are stacked;
the coil includes a coil portion defined by the plurality of conductor patterns that are shaped so as to be wound around the coil axis a plurality of times;
at least one of the plurality of base materials includes the coil portion;
on the at least one of the plurality of base materials on which the coil portion is provided, an innermost conductor pattern and an outer dummy pattern defined by a conductor pattern on an outer side of the coil portion are provided;
and
in at least two perpendicular or substantially perpendicular axial directions along a surface of the at least one of the plurality of base materials, of the plurality of conductor patterns that define the coil portion:
a width of the innermost conductor pattern is larger than a width of the conductor patterns of the coil portion other than the innermost conductor pattern;
the width of the innermost conductor pattern is larger than or equal to a distance between the innermost conductor pattern and the conductor pattern adjacent to the innermost conductor pattern;
a width of the outer dummy pattern is larger than the width of the conductor patterns of the coil portion between the innermost conductor pattern and the outer dummy pattern;
and
a distance between the outer dummy pattern and the conductor pattern of the coil portion adjacent to the outer dummy pattern is smaller than or equal to a distance between the conductor patterns of the coil portion, except a distance between the innermost conductor pattern and the conductor pattern adjacent to the innermost conductor pattern.

13 more elements