US 2017/0363973 A1 · Reticle Cooling by Non-Uniform Gas Flow

Reticle Cooling by Non-Uniform Gas Flow

AssigneesASML Holding N.V., ASML Netherlands B.V.

InventorsThomas VENTURINO, Geoffrey Alan SCHULTZ, Daniel Nicholas GALBURT, Daniel Nathan BURBANK, Santiago E. DELPUERTO, Herman VOGEL, Johannes ONVLEE, Laurentius Johannes Adrianus VAN BOKHOVEN, Christopher Charles WARD

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Abstract

An apparatus, system, and method cool a patterning device by supplying a non-uniform gas flow. The apparatus and system include a gas supply structure that supplies a gas flow across the first surface of the patterning device. The gas supply structure includes a gas supply nozzle specially configured to create a non-uniform gas flow distribution. A greater volume or velocity of the gas flow is directed to desired portion of the patterning device.

Claims24

Dependent claims

A temperature control system, comprising:

a support configured to support an object, the object having a first surface and a second surface;
and
a gas supply nozzle, the gas supply nozzle configured to supply a gas flow across the first surface and configured to produce a non-uniform gas flow profile exiting the gas supply nozzle by unevenly distributing a volume or a velocity of the gas flow.

Dependencies are inferred from the claim text.