Integrated self-coining probe

A method of testing a surface of a semiconductor wafer, said method comprising:

• providing an apparatus comprising a probe head having a first portion and a laterally adjacent second portion, wherein said first portion of said probe head contains a coining surface, and said second portion of said probe head contains a plurality of probe tips, wherein said coining surface and each of said probe tips are located on a same side of said probe head;
• positioning a semiconductor wafer beneath said side of said probe head containing said coining surface and said probe tips, said semiconductor wafer containing at least a first area array of solder bumps and a second area array of solder bumps spaced apart from said first area array of solder bumps;
• and
• moving said probe head across said semiconductor wafer such that said coining surface flattens each solder bump of said first area array of solder bumps prior to flattening each solder bump of said second array of solder bumps, and wherein during said flattening of each solder bump of said second area array of solder bumps, said probe tip contacts a flatten surface of each solder bump of said first area of solder bumps.