Method of manufacturing electroformed components

A method of manufacturing electroformed components comprising:

• forming a first through-hole by patterning a first photoresist layer formed on a front surface side of a conductive layer, the first through-hole penetrating the first photoresist layer along a stacking direction of the conductive layer and the first photoresist layer;
• depositing a first electroformed member on the front surface side of the conductive layer in the first through-hole by electroforming using the conductive layer as one electrode;
• forming a first electroformed component by planarizing the front surface side of the first electroformed member and the first photoresist layer;
• removing the first photoresist layer from the conductive layer having the first electroformed component formed;
• forming a film for separation on a surface of the first electroformed component exposed by removing the first photoresist layer;
• forming a second through-hole by forming on the front surface side of the conductive layer, a second photoresist layer covering the first electroformed component from the front surface side and by patterning the second photoresist layer, the second through-hole penetrating the second photoresist layer along the stacking direction while a portion of the first electroformed component projects inward;
• depositing a second electroformed member on the front surface side of the conductive layer in the second through-hole by electroforming using the conductive layer as one electrode;
• forming a second electroformed component by planarizing the front surface side of the second electroformed member and the second photoresist layer;
• removing the conductive layer from the first electroformed component, the second electroformed component, and the second photoresist layer;
• and
• removing the second photoresist layer from the first electroformed component and the second electroformed component having the conductive layer removed.