Apparatus and method
AssigneeBeneq Oy
InventorsPekka SOININEN, Sami SNECK
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Abstract
An apparatus and a method for processing a surface of a substrate exposes the surface of the substrate to alternating surface reactions of at least a first starting material and a second starting material according to the principles of atomic layer deposition method. A first starting material is fed on the surface of the substrate locally by a source by moving the source in relation to the substrate, and the surface of the substrate processed with the first starting material is exposed to a second starting material present in the atmosphere surrounding the source.
Claims19
An apparatus for processing a surface of a substrate by exposing the surface of the substrate to alternating surface reactions of at least a first starting material and a second starting material according to the principles of atomic layer deposition method, wherein the apparatus comprises one or more sources for feeding the first starting material locally on the surface of the substrate and feeding means for feeding second starting material to atmosphere surrounding the one or more sources, and that the one or more sources are positioned in the atmosphere comprising the second starting material.
The apparatus according to claim wherein the source comprises at least one suction zone for drawing the first starting material or the flushing agent fed on the surface of the substrate or for providing vacuum between the source and the surface of the substrate.
Dependencies are inferred from the claim text.