Tin-silver diffusion soldering for thin joints without flux
AssigneeXerox Corporation
InventorDavid L. Knierim
Life of this patent
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Abstract
A method of bonding two components includes plating a first of the components with a first silver layer, a tin layer, and a second silver layer, plating a second of the components with silver, inserting the first and second components into a pre-heated press, and applying pressure to the components causing the components to bond. A stack of layers has a first component layer, a first silver layer, a tin layer, a second silver layer, a second component silver layer, and a second component layer.
Claims19
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A stack of layers, comprising:
- a first component layer;
- a bond layer on the first component layer, comprising:
- a first silver layer on the first component layer;
- a tin layer on the first silver layer;
- a second silver layer on the tin layer, wherein the second silver layer is thinner than the first silver layer;
- a second component silver layer on the second silver layer;
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- a second component layer on the bond layer.
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Dependencies are inferred from the claim text.