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US 2017/0361320 A1Published application
Method and apparatus for taped interlayer flow cell with masking
AssigneeCorning Incorporated
InventorsAnthony T. Chobot, Raymond M. Karam, Georges Roussos
Life of this patent
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Abstract
A flow cell incorporates a first substrate with a metal layer on one surface. A tape layer having flow channels is adhered to the first substrate. A second substrate having a second metal layer on one surface is adhered to the tape layer opposite the first substrate. At least one of the first and second metal layers includes mating cutouts to at least partially expose the flow channels.
Claims25
A taped interlayer flow cell comprising:
- a first substrate;
- a second substrate;
- and
- a double-sided tape disposed between the first substrate and the second substrate and comprising a carrier material, adhesive layers on top and bottom surfaces of the carrier material, and a flow channel formed therein;
- wherein the first substrate comprises a transparent substrate and a masking layer disposed on the transparent substrate to cover adhesive attachment of the double-sided tape to the first substrate;
- and
- wherein the masking layer comprises a mating cutout to at least partially expose the flow channel of the double-sided tape.
4 more elements
A method of fabricating a plurality of taped interlayer flow cells using wafer processing, the method comprising:
- adhering a tape layer to a first substrate wafer;
- adhering a second substrate wafer to the tape layer, thereby forming a flow cell wafer comprising the tape layer disposed between the first substrate wafer and the second substrate wafer;
- and
- dicing the flow cell wafer to form the plurality of taped interlayer flow cells.
1 more element
Dependencies are inferred from the claim text.