Semiconductor device and manufacturing method therefor, and resin composition for forming flexible resin layer

A method for producing a semiconductor device including a circuit board having a flexible substrate, a circuit component mounted on the flexible substrate, and a flexible resin layer encapsulating the circuit component,

• the method comprising:
• a step of printing an encapsulant on the flexible substrate, and thereby encapsulating the circuit component with the encapsulant;
• and
• a step of curing the encapsulant, and thereby forming the flexible resin layer.

A method for producing a semiconductor device including a circuit board having a flexible substrate, a circuit component mounted on the flexible substrate, and a flexible resin layer encapsulating the circuit component,

• the method comprising:
• a step of immersing the flexible substrate in an encapsulant, drying the encapsulant, and thereby encapsulating the circuit component with the encapsulant;
• and
• a step of curing the encapsulant, and thereby forming the flexible resin layer.

A resin composition for forming a flexible resin layer, the resin composition comprising:

• (A) an elastomer including at least any one of a thermoplastic polyurethane or a styrene-based elastomer;
• (B) a polymerizable compound;
• and
• (C) a polymerization initiator.