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US 2017/0325328 A1Published application
Board-to-board contactless connectors and methods for the assembly thereof
AssigneeKeyssa Systems, Inc.
InventorsRoger D. Isaac, Mostafa Naguib Abdulla
Life of this patent
Estimating the term…
Abstract
The present disclosure relates to extremely high frequency (“EHF”) systems and methods for the use thereof, and more particularly to board-to-board connections using contactless connectors.
Claims31
A device comprising:
- a first circuit board comprising a first contactless communications unit (CCU) mounted to a first surface of the first circuit board;
- a second circuit board comprising a second CCU mounted to a second surface of the second circuit board, wherein the second circuit board is positioned below the first circuit board such that the first and second surfaces face each other and that a contactless board-to-board connection is established via the first and second CCUs;
- a conduit structure mounted to the first and second circuit boards, wherein the conduit structure comprises a EHF channel for directing contactless signals being communicated between the first and second CCUs.
A system comprising:
- a housing;
- a power source;
- a component comprising a first contactless communications unit (CCU);
- a circuit board comprising a second CCU, wherein the first and second CCUs form a contactless connector that contactlessly communicates data between the component and the circuit board, wherein the power source is coupled to the circuit board;
- and
- a conductor that is coupled to the component and the circuit board, and wherein the conductor conveys power from the circuit board to the component.
3 more elements
A method for assembling a device, comprising:
- placing a first circuit board comprising a first contactless communications unit (CCU) into a device housing;
- securing the first circuit board to the device housing;
- mounting a conduit structure to the first circuit board, wherein the conduit structure comprises an EHF channel for guiding contactless signals being communicated between CCUs;
- aligning a second circuit board comprising a second CCU with respect to the first circuit board such that the second CCU is positioned within predefined alignment parameters of the first CCU to establish a contactless board-to-board connection between the first and second CCUs;
- and
- securing the first and second circuit boards in a fixed position with respect to each other after the second circuit board is aligned with the first circuit board, wherein the conduit structure is secured to the second circuit board when the first and second circuit boards are secured in the fixed position.
3 more elements
A method for replacing physical interfacing connectors that convey data in board-to-board or board-to-component connections with contactless connectors, the method comprising:
- securing a first substrate with respect to a second substrate, wherein the first substrate comprises a first contactless communications unit (CCU) and the second substrate comprises a second CCU;
- and
- establishing a contactless substrate-to-substrate connection via the first and second CCUs, wherein data is contactlessly communicated between the first and second substrates using the contactless substrate-to-substrate connection.
31-51. (canceled)
Dependencies are inferred from the claim text.