US 2017/0324398 A1 · SAW DEVICE AND METHOD FOR MANUFACTURING SAW DEVICE

Abstract

A SAW device includes a SAW element, a conductor connected to the SAW element, an LT substrate including the SAW element, and a case for housing the LT substrate including the SAW element. The case includes a cover part, a lateral part, and a bottom part. The bottom part is including a sapphire substrate, the LT substrate is positioned on a first surface of the sapphire substrate, the first surface serving as an inner surface of the case, and a second surface opposite to the first surface serves as an outer surface of the case. The conductor includes a via conductor provided in a through-hole continuously penetrating through the sapphire substrate and the LT substrate.

Claims12

Dependent claims

A SAW device comprising:

a SAW element;
a conductor connected to the SAW element;
an LT substrate including the SAW element;
and
a case for housing the LT substrate including the SAW element, wherein
the case includes a cover part, a lateral part, and a bottom part,
the bottom part includes a sapphire substrate, the LT substrate is positioned on a first surface of the sapphire substrate, the first surface serving as an inner surface of the case, and a second surface opposite to the first surface serves as an outer surface of the case, and
the conductor includes a via conductor provided in a through-hole continuously penetrating through the sapphire substrate and the LT substrate.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application

15/529,552Filed 27 Nov 2015

Priority

JP 2014-24089528 Nov 2014

Published

9 Nov 2017

Term ends

Not estimatedThe source records don’t support an estimate.

Classification13 codes

H03H 9/25
Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators: constructional features of resonators using…
H03H 3/08
For the manufacture of electromechanical resonators or networks: for the manufacture of resonators or networks using surface acoustic waves
H03H 9/02559
Characteristics of substrate, e.g. cutting angles: of lithium niobate or lithium-tantalate substrates
H03H 9/1071
For surface acoustic wave [SAW] devices: the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical…

Saw device and method for manufacturing saw device

Life of this patent

Saw device and method for manufacturing saw device

Life of this patent

Abstract

Claims12