Method of generating a power semiconductor module

Abstract

The present application relates to a method of generating a power semiconductor module including a carrier layer and a substrate having a terminal connection area, the method comprising: soldering the substrate to the carrier layer by forming a solder layer; wherein the solder layer is formed such, that a pre-defined cavity is provided in the solder layer adjacent to the substrate and located opposite to the terminal connection area; and welding a terminal to the terminal connection area of the substrate. The present application provides a method of generating a power semiconductor module which is especially cost-saving to perform and allows a reliable generation of high quality modules.

Dependencies are inferred from the claim text.