Method and aparatus for monitoring a junction between electrical devices

A method for evaluating a junction that is formed between an electrical lead trace and a busbar, the method comprising:

• connecting an electrical test fixture disposed to monitor electrical conductivity across the electrical connector and the busbar;
• applying an electrical potential across the electrical connector and the busbar;
• inducing a mechanical stress proximal to the junction and coincidently monitoring the electrical conductivity across the electrical connector and the busbar employing the electrical test circuit;
• and
• evaluating integrity of the junction based upon the monitoring of the electrical conductivity across the electrical connector and the busbar when inducing the mechanical stress.

A test fixture for evaluating a battery cell interconnect board, wherein the battery cell interconnect board includes a plurality of junctions between a plurality of electrical lead traces and a corresponding plurality of busbars, comprising:

• an electric power supply disposed to supply electric power to the plurality of electrical lead traces;
• a controller including an electric monitoring device, wherein the controller is disposed to monitor electrical potential across each of the junctions between the electrical lead traces and the busbars;
• and
• a mechanical stress-inducing device disposed to apply mechanical stress proximal to each of the junctions;
• wherein the controller is disposed to control the mechanical stress-inducing device to apply mechanical stress proximal to the junctions when the electric power supply is supplying electric power to the electrical lead trace;
• and
• wherein the controller is disposed to monitor, via the electric monitoring device, the electrical potentials across the junctions of the electrical lead traces.