Heating chamber and semiconductor processing apparatus

A semiconductor processing apparatus, comprising a heating chamber having a vacuum environment inside and including a substrate transferring window for a substrate to pass through, wherein the heating chamber further comprises:

• a heating barrel, disposed in the heating, chamber and located above the substrate transferring window;
• an annular heating device, fixedly connected to the heating barrel and disposed around an inner side of the heating barrel, and being configured to radiate heat from a periphery of the heating barrel to an interior of the heating barrel;
• a substrate cassette, configured to bear a plurality of layers of substrates and allow the plurality of layers of substrate to be arranged at intervals in an axial direction of the heating barrel:
• and
• a substrate cassette lifting device, configured to drive the substrate cassette to move up into an internal space defined by the annular heating device, or move down to a position corresponding to the substrate transferring window.