Electrical shielding using bar vias and associated methods
AssigneeSTMicroelectronics (Grenoble 2) SAS
InventorsLaurent Marechal, Richard Rembert, Jerome Lopez
Life of this patent
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Abstract
An electronic device disclosed herein includes a first conductor layer, a first nonconducting layer, and a second conductor layer in a stacked arrangement. A signal carrying conductive via is formed in the first nonconducting layer and extends between the first conductor layer and the second conductor layer. A shielding conductive via is formed in the first nonconducting layer, is not electrically coupled to the signal carrying conductive via, and substantially completely surrounds the signal carrying conductive via in spaced apart relation thereto.
Claims20
An electronic device, comprising:
- a first conductor layer, a first nonconducting layer, and a second conductor layer in a stacked arrangement;
- a signal carrying conductive via formed in the first nonconducting layer and extending between the first conductor layer and the second conductor layer;
- a shielding conductive via formed in the first nonconducting layer, not electrically coupled to the signal carrying conductive via, and substantially completely surrounding the signal carrying conductive via in spaced apart relation thereto.
An electronic device, comprising:
- a first conductor layer, a first nonconducting layer, and a second conductor layer in a stacked arrangement;
- first and second signal carrying structures that are not directly electrically coupled;
- wherein the first signal carrying structure comprises:
- a first signal carrying conductive trace formed in the first conductor layer,
- a second signal carrying conductive trace formed in the second conductor layer,
- a first signal carrying conductive via formed in the first nonconducting layer and coupling the first and second signal carrying conductive traces;
- wherein the second signal carrying structure comprises;
- a third signal carrying conductive trace formed in a selected one of the first conductor layer and the second conductor layer,
- a second signal carrying conductive via formed in the first nonconducting layer to extend between the first and second conductor layers and being electrically coupled to the third signal carrying conductive trace,
- a shielding conductive structure substantially completely surrounding at least a portion of the first signal carrying structure and not the second signal carrying structure.
A method of making an electronic device, comprising:
- forming a signal via extending between first and second opposed sides of a printed circuit board layer;
- and
- forming a bar via that extends between the first and second surfaces, that is not electrically connected to the signal via, and that substantially completely surrounds the signal via to form an electromagnetic shell.
Dependencies are inferred from the claim text.