Air dielectric printed circuit board

An air dielectric printed circuit board (PCB) comprising:

• a first PCB layer including a first substrate and a first conductive layer formed of a first conductive material;
• a second PCB layer including a second substrate and a second conductive layer formed of a second conductive material, wherein the second conductive layer is disposed
• in a directly facing configuration relative to the first conductive layer, and
• at a predetermined distance away from the first conductive layer, wherein the predetermined distance provides an air dielectric gap between the first and second conductive layers;
• and
• at least two standoffs, wherein each of the at least two standoffs
• includes a first end and a second end that is opposite to the first end,
• is attached to the first and second PCB layers respectively at the first and second ends thereof, and
• includes a predetermined shape to maintain the predetermined distance, and
• wherein a standoff of the at least two standoffs is spaced from another standoff of the at least two standoffs at a predetermined spacing distance, and wherein the predetermined spacing distance is determined such that an electric field generated between the first and second conductive layers is formed substantially within the air dielectric gap and substantially between the spaced standoffs.

An air dielectric printed circuit board (PCB) comprising:

• a first PCB layer including a first substrate and a first conductive layer formed of a first conductive material;
• a second PCB layer including a second substrate and a second conductive layer formed of a second conductive material, wherein
• the first and second substrates include a substantially uniform cross-section respectively across the first and second PCB layers,
• the second conductive layer is disposed in a directly facing configuration relative to the first conductive layer, and
• the second conductive layer is disposed at a predetermined distance away from the first conductive layer, wherein the predetermined distance provides an air dielectric gap between the first and second conductive layers;
• and
• at least one standoff, wherein the at least one standoff
• includes a first end and a second end that is opposite to the first end,
• is attached to the first and second PCB layers respectively at the first and second ends thereof, and
• includes a predetermined shape to maintain the predetermined distance.