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US 2017/0318402 A1Published application
Hearing aid adapted for embedded electronics
AssigneeStarkey Laboratories, Inc.
InventorsDouglas F. Link, David Prchal, Sidney A. Higgins
Life of this patent
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Abstract
A hearing aid comprising a microphone, a receiver, hearing aid electronics coupled to the microphone and the receiver, and conductive traces overlaying an insulator, the conductive traces configured to interconnect the hearing aid electronics and to follow non-planar contours of the insulator. Examples are provided wherein the insulator includes a hearing aid housing.
Claims20
A hearing aid comprising:
- a microphone;
- a receiver;
- hearing aid electronics coupled to the microphone and the receiver;
- and
- conductive traces overlaying an insulator, the conductive traces provided using Molded Interconnect Device (MID) technology and configured to interconnect the hearing aid electronics and to follow non-planar contours of the insulator.
2 more elements
A method of manufacturing a hearing aid, the method comprising:
- providing a housing for the hearing aid, the housing including integrated electrical components embedded within a sidewall of the housing;
- and
- providing multi-axis conductive traces along contours of the sidewall of the housing using Molded Interconnect Device (MID) technology, the conductive traces overlaying an insulator and following non-planar contours of the insulator, the conductive traces configured to connect the integrated electrical components to hearing aid electronics within the housing using the conductive traces.
Dependencies are inferred from the claim text.