Laser etching apparatus and a method of laser etching using the same

A method of laser etching using a laser etching apparatus, wherein the laser etching apparatus comprises a chamber, a laser port disposed below the chamber in a downward direction, a laser emitter, a particle grabber including a body disposed over the laser port and having an opening, and a revolving window module comprising a revolving window disposed between the particle grabber and the laser port and a driving part configured to drive the revolving window,

• wherein the method comprises:
• loading a first substrate having a first organic film disposed thereon into the chamber;
• performing a first substrate laser etching process, wherein the first organic film disposed on the first substrate is etched by the laser;
• rotating the revolving window by a predetermined angle to locate an unpolluted portion of the revolving window disposed between the laser emitter and the particle grabber;
• unloading the first substrate from the chamber;
• loading a second substrate having a second organic film disposed thereon into the chamber;
• and
• performing a second substrate laser etching process, wherein the second organic film disposed on the second substrate is etched by the laser.