Printed wiring board and method for manufacturing the same

A method for manufacturing a printed wiring board, comprising:

• forming, on a surface of a laminated base material comprising a pad conductor layer, a plurality of solder resist precursor layers such that the plurality of solder resist precursor layers includes a first solder resist precursor layer formed on the surface of the laminated base material and comprising a first resin composition including a photosensitive resin material and a photopolymerization initiator and that the plurality of solder resist precursor layers includes a k-th solder resist precursor layer formed on a (k−1)-th solder resist precursor layer and comprising a k-th resin composition including a photosensitive resin material and a photopolymerization initiator, where k=2 to n, and n is an integer equal to or greater than 2;
• irradiating light upon the plurality of solder resist precursor layers except for regions corresponding to a plurality of opening portions such that the plurality of solder resist precursor layers from the first solder resist precursor layer to the n-th solder resist precursor layer is cured;
• and
• developing the plurality of solder resist precursor layers with a liquid developer such that a solder resist layer having the plurality of opening portions exposing a plurality of conductor pads of the pad conductor layer is formed,
• wherein the plurality of solder resist precursor layers is formed such that a photocuring ability of the (k−1)-th resin composition is same as or higher than a photocuring ability of the k-th resin composition and that a photocuring ability of the first resin composition is higher than a photocuring ability of the n-th resin composition, and the laminated base material includes an insulating layer and the pad conductor layer formed on the insulating layer.