Printed circuit board and method of manufacturing the same

A method of manufacturing a printed circuit board including the steps of:

• forming a ground layer having electric conductivity higher than that of a support substrate on the support substrate formed of a conductive material;
• forming a first insulating layer on the support substrate;
• forming a lower wiring trace on the first insulating layer;
• forming a second insulating layer on the first insulating layer to cover the ground layer and the lower wiring trace;
• and
• forming an upper wiring trace on the second insulating layer to overlap with the ground layer, wherein
• the step of forming the ground layer and the lower wiring trace includes forming the ground layer and the lower wiring trace such that a distance between the ground layer and the upper wiring trace is larger than a distance between the lower wiring trace and the upper wiring trace in a stacking direction of the support substrate, the first insulating layer and the second insulating layer.