Systems and methods for thermal management for high power density emi shielded electronic devices

A thermal and electro-magnetic interference (EMI) management system for an integrated circuit device, the system comprising:

• at least one electro-magnetic interference (EMI) shield fence, wherein the integrated circuit device is mounted to a substrate within a perimeter defined by the EMI shield fence;
• and
• an heatsink EMI shield lid that secures onto the at least one EMI shield fence, wherein the heatsink EMI shield lid seals the at least one integrated circuit within the at least one EMI shield fence;
• wherein the heatsink EMI shield lid comprises a spring loaded thermal interface configured to compress against the at least one integrated circuit.

A method for thermal and electro-magnetic interference (EMI) management for an integrated circuit device, the method comprising:

• surrounding one or more integrated circuit devices within a perimeter defined by at least one electro-magnetic interference (EMI) shield fence;
• securing a heatsink EMI shield lid onto the at least one EMI shield fence, wherein the heatsink EMI shield lid seals the at least one integrated circuit within the at least one EMI shield fence, wherein the heatsink EMI shield lid comprise a spring loaded thermal interface;
• and
• applying the spring loaded thermal interface against the one or more integrated circuit devices.