Thermal modulation of an electronic device

A method of thermally modulating an electronic device that includes an integrated circuit, a flexible heat spreader, and an actuator, the method comprising:

• controlling the actuator between a first actuation mode and a second actuation mode, wherein:
• when in the first actuation mode, the actuator positions the flexible heat spreader with an air gap between the flexible heat spreader and the integrated circuit such that the flexible heat spreader is thermally separated from the integrated circuit to increase a thermal impedance between the flexible heat spreader and the integrated circuit, and
• when in the second actuation mode, the actuator positions the flexible heat spreader in thermal contact with the integrated circuit without the air gap there between to reduce the thermal impedance between the flexible heat spreader and the integrated circuit;
• switching the actuator from the first actuation mode to the second actuation mode during a benchmarking procedure performed by the electronic device, wherein the benchmarking procedure includes one or more operations to measure a performance of the integrated circuit;
• and
• switching the actuator back to the first actuation mode upon completion of the benchmarking procedure.

An electronic device, comprising:

• an integrated circuit;
• a heat spreading means for dispersing heat generated by the integrated circuit;
• an actuator means for positioning the heat spreading means in a first position while in a first actuation mode and in a second position while in a second actuation mode;
• and
• a means for controlling the actuator means between the first actuation mode and the second actuation mode, wherein
• when in the first actuation mode, the first position comprises the flexible heat spreader positioned with an air gap between the flexible heat spreader and the integrated circuit such that the flexible heat spreader is thermally separated from the integrated circuit to increase a thermal impedance between the flexible heat spreader and the integrated circuit, and
• when in the second actuation mode, the second position comprises the flexible heat spreader positioned in thermal contact with the integrated circuit without the air gap there between to reduce the thermal impedance between the flexible heat spreader and the integrated circuit;
• means for switching the actuator means from the first actuation mode to the second actuation mode during a benchmarking procedure performed by the electronic device, wherein the benchmarking procedure includes one or more operations to measure a performance of the integrated circuit;
• and
• means for switching the actuator means back to the first actuation mode upon completion of the benchmarking procedure.

A wireless mobile station, comprising:

• an integrated circuit disposed within an exterior housing of the wireless mobile station;
• a flexible heat spreader comprising a structure configured to disperse heat generated by the integrated circuit to at least the exterior housing, the structure selected from the group consisting of a graphite sheet, a metal sheet, a copper sheet, and a mid-frame of the wireless mobile station;
• an actuator comprising a piezo electric layer coupled to the flexible heat spreader;
• and
• a controller coupled to the actuator and configured to control the actuator between a first actuation mode and a second actuation mode, wherein the controller is configured to switch the actuator to the second actuation mode by applying an actuation voltage to the piezo electric layer and to switch the actuator to the first actuation mode by removing the actuation voltage from the piezo electric layer, wherein:
• when in the first actuation mode, the actuator positions the flexible heat spreader with an air gap between the flexible heat spreader and the integrated circuit such that the flexible heat spreader is thermally separated from the integrated circuit to increase a thermal impedance between the flexible heat spreader and the integrated circuit, wherein the piezo electric layer is configured to have a planar non-curved shape when the actuator is in the first actuation mode,
• when in the second actuation mode, the actuator positions the flexible heat spreader in thermal contact with the integrated circuit without the air gap there between to reduce the thermal impedance between the flexible heat spreader and the integrated circuit, wherein the piezo electric layer is configured to have a curved shape when the actuator is in the second actuation mode,
• the controller is configured to switch the actuator from the first actuation mode to the second actuation mode during a benchmarking procedure performed by the electronic device, wherein the benchmarking procedure includes one or more operations to measure a performance of the integrated circuit, and
• the controller is configured to switch the actuator back to the first actuation mode upon completion of the benchmarking procedure.