Electronic device, and electronic structure provided with electronic device

An electronic device comprising:

• a circuit board including
• an insulating substrate,
• a wiring arranged at the substrate,
• an electronic component mounted at the substrate and electrically connected to the wiring,
• at least one through hole which is arranged through the substrate from one surface of the substrate to an opposite surface of the one surface of the substrate, and
• a conductive member arranged at a surface of the through hole and electrically connected to the wiring;
• and the electronic device further comprising:
• a sealing resin that seals the electronic component;
• and
• a cap that is mounted at the substrate, and that includes
• an annular connection including a part connected to the substrate and
• a recess that is recessed from the annular connection, wherein:
• the cap is configured such that at least a part of the connection is connected to the substrate to arrange a space communicating with the through hole with the recess facing one of an open end of the one surface of the substrate and an open end of the opposite surface of the one surface of the substrate of the through hole, the cap being sealed integrally with the electronic component by the sealing resin;
• wherein the cap includes the recess and a flange as the connection protruded from the recess.

An electronic device comprising:

• a circuit board including
• an insulating substrate,
• a wiring arranged at the substrate,
• an electronic component mounted at the substrate and electrically connected to the wiring,
• at least one through hole which is arranged through the substrate from one surface of the substrate to an opposite surface of the one surface of the substrate, and
• a conductive member arranged at a surface of the through hole and electrically connected to the wiring;
• and the electronic device further comprising:
• a sealing resin that seals the electronic component;
• and
• a cap that is mounted at the substrate, and that includes
• an annular connection including a part connected to the substrate and
• a recess that is recessed from the annular connection, wherein:
• the cap is configured such that at least a part of the connection is connected to the substrate to arrange a space communicating with the through hole with the recess facing one of an open end of the one surface of the substrate and an open end of the opposite surface of the one surface of the substrate of the through hole, the cap being sealed integrally with the electronic component by the sealing resin;
• a plurality of the through holes is arranged at the substrate;
• and
• the cap is arranged individually for each of the plurality of through holes.

An electronic device comprising:

• a circuit board including
• an insulating substrate,
• a wiring arranged at the substrate,
• an electronic component mounted at the substrate and electrically connected to the wiring,
• at least one through hole which is arranged through the substrate from one surface of the substrate to an opposite surface of the one surface of the substrate, and
• a conductive member arranged at a surface of the through hole and electrically connected to the wiring;
• and the electronic device further comprising:
• a sealing resin that seals the electronic component;
• and
• a cap that is mounted at the substrate, and that includes
• an annular connection including a part connected to the substrate and
• a recess that is recessed from the annular connection, wherein:
• the cap is configured such that at least a part of the connection is connected to the substrate to arrange a space communicating with the through hole with the recess facing one of an open end of the one surface of the substrate and an open end of the opposite surface of the one surface of the substrate of the through hole, the cap being sealed integrally with the electronic component by the sealing resin;
• a plurality of lands are arranged at intervals in a region, which faces the connection, of the substrate;
• and
• the cap is mounted through the plurality of lands.

An electronic structure comprising:

• an electronic device including:
• a circuit board including
• an insulating substrate,
• a wiring arranged at the substrate,
• an electronic component mounted at the substrate and electrically connected to the wiring,
• at least one through hole which is arranged through the substrate from one surface of the substrate to an opposite surface of the one surface of the substrate, and
• a conductive member arranged at a surface of the through hole and electrically connected to the wiring;
• and the electronic device further including:
• a sealing resin that seals the electronic component;
• and
• a cap that is mounted at the substrate, and that includes
• an annular connection including a part connected to the substrate and
• a recess that is recessed from the annular connection,
• in which the cap is configured such that at least a part of the connection is connected to the substrate to arrange a space communicating with the through hole with the recess facing one of an open end of the one surface of the substrate and an open end of the opposite surface of the one surface of the substrate of the through hole, the cap being sealed integrally with the electronic component by the sealing resin;
• the terminal;
• and
• a housing member that arranges a housing space to house the electronic device and houses the electronic device in the housing space, and that includes
• a first member, which is made of metal, includes a part facing a surface at which the cap is mounted of the substrate, and is in contact with the electronic device;
• and
• a second member, which is joined to the first member to arrange the housing space, includes a part facing a surface, at which the cap is not mounted, of the substrate, and has the terminal protruded into the housing space.