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US 2017/0290170 A1Published application
Method Of Making A Camera For Use On A Vehicle
AssigneeDelphi Technologies, Inc.
InventorsYew Kwang Low, Ward K. Everly, Ronald M. Taylor
Life of this patent
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Abstract
An illustrative example method of making a camera includes assembling a plurality of lens elements, a sensor, and a housing to establish an assembly with each of the lens elements and the sensor at least partially in the housing. The assembly is then situated adjacent a circuit board substrate. At least the sensor is secured to the circuit board substrate using surface mount technology (SMT) and the assembly becomes fixed relative to the circuit board substrate.
Claims22
A method of making a camera, the method comprising:
- assembling a plurality of lens elements, a sensor, and a housing to establish an assembly with each of the lens elements and the sensor at least partially in the housing;
- situating the assembly adjacent a circuit board substrate;
- supporting an objective on an objective housing;
- situating the objective housing adjacent the circuit board substrate with a thermal curable material at an interface between the objective housing and the circuit board substrate;
- securing at least the sensor to the circuit board substrate using surface mount technology (SMT), wherein the assembly is fixed relative to the circuit board substrate by the securing;
- and
- securing the objective housing to the circuit board substrate by curing the thermal curable material while using the SMT for securing at least the sensor to the circuit board substrate.
4 more elements
(canceled)
A camera, comprising:
- a plurality of lens elements;
- a sensor;
- a housing, each of the plurality of lens elements being at least partially within the housing, the sensor being at least partially within the housing;
- a circuit board substrate;
- an objective;
- an objective housing supporting the objective, the objective housing having a portion received adjacent the circuit board substrate;
- and
- a thermal curable material at an interface between the objective housing and the circuit board substrate,
- wherein
- a connection between at least the sensor and the circuit board substrate is established using surface mount technology (SMT) that secures the sensor to the circuit board substrate,
- the housing, the sensor, and the plurality of lens elements are secured in a fixed position relative to the circuit board substrate by the connection between at least the sensor and the circuit board substrate, and
- a connection between the objective housing and the circuit board substrate is established by curing the thermal curable material while using the SMT to secure the sensor to the circuit board substrate.
9 more elements
Dependencies are inferred from the claim text.