Thin film component sheet, board with built-in electronic component, and method of manufacturing the thin film component sheet

A method of manufacturing a thin film component sheet including an interconnection layer formed of a conductor, an insulating layer laminated on the interconnection layer and formed of an insulating material, and a plurality of thin film electronic components, each having a pair of electrode layers and a dielectric layer provided between the pair of electrode layers, and arranged to be separated on the insulating layer, the manufacturing method comprising:

• a thin film electronic component preparing process of preparing a carrier sheet to which the plurality of thin film electronic components are adhered;
• a thin film electronic component embedding process of pressing the carrier sheet, to which the thin film electronic components are adhered, against an insulating layer of an interconnection structure in which the interconnection layer and the insulating layer are laminated, to thereby embed the thin film electronic components into the insulating layer and fonn a flat surface of a main surface of one side of the thin film component sheet;
• and
• a sheet removing process of removing the carrier sheet to expose a main surface of one of the electrode layers in each of the plurality of thin film electronic components to an outside on the main surface of the one side of the thin film component sheet.