Electrical component, component arrangement, and a method for producing an electrical component and component arrangement

An electrical component for embedding in a carrier, comprising a ceramic main body, an electrically insulating passivation layer which is applied to the main body, at least one inner electrode, and an outer electrode which is connected to the inner electrode, wherein the outer electrode comprises a first electrode layer comprising a metal and a second electrode layer which is arranged on the latter and comprises copper.

The electrical component according to claim 1, wherein the first electrode layer comprises a burnt-in paste.

A component arrangement, comprising:

• an electrical component for embedding in a carrier, comprising a ceramic main body, an electrically insulating passivation layer which is applied to the main body, at least one inner electrode, and an outer electrode which is connected to the inner electrode, wherein the outer electrode comprises a first electrode layer comprising a metal and a second electrode layer which is arranged on the latter and comprises copper;
• and
• a carrier into which the electrical component is embedded.

The component arrangement according to claim 37, wherein the through-connection contains copper.

The component arrangement according to claim 37 further comprising at least one connection contact arranged on an outer side of the carrier, wherein the connection contact is connected to the through-connection.

The component arrangement according to claim 39, wherein the at least one connection contact, the through-connection and the second electrode layer comprise the same material.

A method for producing an electrical component, said method comprising:

• providing a ceramic main body comprising inner electrodes, which is surrounded by an electrically insulating passivation layer,
• applying a first electrode layer to the passivation layer,
• applying a second, copper-containing electrode layer to the first electrode layer by means of one of a galvanic method and an electrochemical method.

The method of claim 41 further comprising providing layers for forming a carrier, wherein at least one layer comprises a cutout, arranging the layers one on top of another and in the process arranging the component in the cutout, and pressing the layers together.

The method according to claim 42 further comprising introducing at least one hole into at least one of the layers and filling the hole with copper to form a through-connection.

The method according to claim 41, wherein the second electrode layer is the outermost layer of an outer electrode.