Electronic package including cavity defined by resin and method of forming same

An electronic device comprising:

• an electronic component including a first substrate having a functional unit formed on a main surface of the first substrate and a first resin layer formed on the main surface thereof, the first resin layer having a first surface facing the main surface of the first substrate and a second surface opposed to the first surface, the first resin layer defining a cavity on the first surface enclosing the functional unit, the first resin layer including a recess on the second surface;
• a second substrate having an electrode pad formed on a main surface thereof, a solder layer disposed in the recess in contact with the electrode pad, the solder layer and the electrode pad having a combined thickness corresponding to a distance between the main surface of the first substrate and the main surface of the second substrate;
• and
• a second resin layer sealing the electronic component and the second substrate.

A method of manufacturing an electronic device, the method comprising:

• preparing an electronic component including a first substrate on a main surface of which a functional unit and a first resin layer are formed, the first resin layer having a first surface facing the main surface of the first substrate and a second surface opposed to the first surface, the first resin layer including a cavity on the first surface enclosing the functional unit, the first resin layer defining a recess on the second surface, the recess being provided with a solder layer;
• preparing a second substrate having an electrode pad formed on a main surface of the second substrate;
• aligning the electronic component with the second substrate to layer the solder layer and the electrode pad in contact with the solder layer to have a combined thickness corresponding to a distance between the main surface of the first substrate and the main surface of the second substrate in the recess;
• and
• forming the electronic component and the second substrate into the electronic device.

A method of manufacturing an electronic component, comprising:

• forming a functional unit on a main surface of a substrate;
• forming a resin layer on the main surface, the resin layer having a first surface facing the main surface and a second surface opposed to the first surface;
• forming a cavity enclosing the functional unit by the first surface;
• forming a recess on the second surface;
• and
• forming a solder layer in the recess so as not to exceed the second surface in a thickness direction.