US 2017/0290158 A1 · SURFACE-MOUNTABLE POWER DELIVERY BUS BOARD

Abstract

IC device assemblies including a power delivery bus board that is mounted to a primary PCB (i.e., motherboard) that further hosts a power-sink device and a power-source device. The bus board, as a secondary PCB, may be surface-mounted on a back side of the primary PCB opposite the power source and sink devices, which are mounted on the front side of the primary PCB. The bus board need only be dimensioned so as to bridge a length between first and second back-side regions of the primary PCB that are further coupled to a portion of the front-side pads employed by the power-sink device. The secondary PCB may be purpose-built for conveying power between the source and sink devices, and include, for example, short, wide traces, that may be formed from multiple heavyweight metallization layers.

Claims20

Dependent claims

An integrated circuit (IC) device assembly, comprising:

a primary printed circuit board (PCB) further including:
first front-side pads disposed within a first front-side region of the primary PCB;
second front-side pads disposed within a second front-side region of the primary PCB;
first back-side pads disposed within a first back-side region, opposite the first front-side region, wherein the first back-side pads are electrically coupled through the primary PCB to the first front-side pads;
and
second back-side pads disposed within a second back-side region, opposite the second front-side region, wherein the second back-side pads are electrically coupled through the primary PCB to a first portion of the second front-side pads;
and
a secondary PCB mounted to a back side of the primary PCB, the secondary PCB bridging a length between the first and second back-side regions and comprising two or more layers of conductive traces electrically coupling the first and second back-side pads.

5 more elements

A computer platform, comprising:

a primary printed circuit board (PCB) further including:
first front-side pads disposed within a first front-side region of the primary PCB;
second front-side pads disposed within a second front-side region of the primary PCB;
first back-side pads disposed within a first back-side region, opposite the first front-side region, wherein the first back-side pads are electrically coupled through the primary PCB to the first front-side pads;
and
second back-side pads disposed within a second back-side region, opposite the second front-side region, wherein the second back-side pads are electrically coupled through the primary PCB to a first portion of the second front-side pads;
one or more voltage regulators mounted to the first front-side pads;
one or more microprocessors mounted to the second front-side pads, the microprocessors having a number of power and ground connections equal to the first portion of the second front-side pads;
and
a secondary PCB mounted to a back side of the primary PCB, the secondary PCB bridging a length between the first and second back-side regions and comprising two or more layers of conductive traces electrically coupling the first and second back-side pads.

7 more elements

A method of assembling an printed circuit assembly (PCA), the method comprising:

receiving a primary printed circuit board (PCB) including:
first front-side pads disposed within a first front-side region of the primary PCB;
second front-side pads disposed within a second front-side region of the primary PCB;
and
first back-side pads disposed within a first back-side region, opposite the first front-side region, wherein the first back-side pads are electrically coupled through the primary PCB to the first front-side pads;
and
second back-side pads disposed within a second back-side region, opposite the second front-side region, wherein the second back-side pads are electrically coupled through the primary PCB to a first portion of the second front-side pads;
mounting a power-source device to the first front-side pads;
mounting a power-sink device to the second front-side pads;
and
mounting a secondary PCB to a back side of the primary PCB, the secondary PCB bridging a length between the first and second back-side regions and comprising two or more layers of conductive traces electrically coupling the first and second back-side pads.

8 more elements

Dependencies are inferred from the claim text.

Surface-mountable power delivery bus board

Life of this patent

Surface-mountable power delivery bus board

Life of this patent

Abstract

Claims20