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US 2017/0290157 A1Published application
Magnetically-coupled inductors on integrated passive devices and assemblies including same
AssigneeFerric Inc.
InventorsNoah Sturcken, Ryan Davies, Hao Wu, Michael Lekas
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Abstract
An integrated passive device and assemblies containing the same are disclosed. The integrated passive device can include a thin-film magnetic inductor. Various configurations of electrically connecting an integrated passive device to a processor and/or an interposer such as a chip-scale package are also disclosed. An inductor on an integrated passive device can configured and arranged such that it is magnetically coupled to an inductor on a structure such as a processor chip or a system on a chip.
Claims16
An assembly comprising:
- a processor chip having opposing first and second sides, the processor chip comprising:
- a first multilevel wiring structure;
- and
- a first inductor integrated into said first multilevel wiring network and disposed proximal to the first side of the processor chip, said first inductor comprising:
- a first planar magnetic core;
- and
- a first conductive winding comprising at least a portion of said first multilevel wiring network, said first conductive winding turning around in a generally spiral manner around said first planar magnetic core;
- an integrated passive device (IPD) having opposing first and second sides, the first side of the IPD mounted on the first side of the processor chip, the IPD comprising:
- a second multilevel wiring structure;
- and
- a plurality of passive devices electrically connected to the second multilevel wiring structure, the plurality of passive devices including a second inductor disposed proximal to the first side of the IPD, the second inductor comprising:
- a second magnetic core;
- and
- a second conductive winding comprising at least a portion of said second multilevel wiring structure, said second conductive winding turning around in a generally spiral manner around said second planar magnetic core,
- wherein the first and second inductors are magnetically coupled.
12 more elements
An assembly comprising:
- an interposer having a plurality of wire traces, the wire traces extending from a first side to a second side of the interposer, the first and second sides on opposing sides of the interposer;
- a processor chip having opposing first and second sides, the processor chip comprising:
- a first multilevel wiring structure;
- and
- a first inductor integrated into said first multilevel wiring network and disposed proximal to the first side of the processor chip, said first inductor comprising:
- a first planar magnetic core;
- and
- a first conductive winding comprising at least a portion of said first multilevel wiring network, said first conductive winding turning around in a generally spiral manner around said first planar magnetic core;
- a plurality of solder bumps disposed between the processor chip and the first side of the interposer, the solder bumps forming a plurality of gaps between adjacent solder bumps;
- and
- an integrated passive device (IPD) having opposing first and second sides, the first side of the IPD mounted on the first side of the processor chip, the IPD disposed in one of said plurality of gaps, the IPD comprising:
- a second multilevel wiring structure;
- and
- a plurality of passive devices electrically connected to the second multilevel wiring structure, the plurality of passive devices including a second inductor disposed proximal to the first side of the IPD, the second inductor comprising:
- a second magnetic core;
- and
- a second conductive winding comprising at least a portion of said second multilevel wiring structure, said second conductive winding turning around in a generally spiral manner around said second planar magnetic core,
- wherein the first and second inductors are magnetically coupled.
15 more elements
Dependencies are inferred from the claim text.