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US 2017/0290156 A1Published application
Integrated Passive Devices and Assemblies Including Same
AssigneeFerric Inc.
InventorsNoah Sturcken, Ryan Davies, Hao Wu, Michael Lekas
Life of this patent
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Abstract
An integrated passive device and assemblies containing the same are disclosed. The integrated passive device can include a thin-film magnetic inductor. Various configurations of electrically connecting an integrated passive device to a processor and/or an interposer such as a chip-scale package are also disclosed.
Claims44
An integrated passive device comprising:
- a substrate;
- a first insulator layer disposed on the substrate;
- a multilevel wiring structure defined in the first insulator layer;
- and
- a thin-film magnetic inductor comprising at least a portion of the multilevel wiring structure, the inductor including:
- a first wiring plane of the multilevel wiring structure, the first wiring plane including a first metal wire;
- a second wiring plane of the multilevel wiring structure, the second wiring plane including a second metal wire;
- a vertical conductive interconnect (VIA) extending from the first wire to the second wire, the VIA electrically connecting the first and second wires;
- a second insulator layer disposed between the first and second wiring planes;
- and
- a magnetic core disposed within the second insulator layer,
- wherein the first metal wire, the VIA, and the second metal wire comprise a conductive winding around the magnetic core, and
- wherein the thin-film magnetic inductor has a height of 50 microns or less.
10 more elements
An assembly comprising:
- an interposer having a plurality of wire traces, the wire traces extending from a first side to a second side of the interposer, the first and second sides of the interposer on opposing sides of the interposer;
- a processor chip disposed proximal to the first side of the interposer, the processor chip electrically connected to a first wire trace on the first side of the interposer;
- a circuit board disposed proximal to the second side of the interposer, the circuit board in electrical communication with a second wire trace on the second side of the interposer;
- a solder ball disposed between the interposer and the circuit board, the solder ball forming an electrical connection and a physical connection between the second wire trace on the interposer and a wire trace on the circuit board, the second solder ball forming a gap between the second side of the interposer and the circuit board;
- and
- an integrated passive device (IPD) electrically connected to the second side of the interposer, the IPD disposed in the gap, an integrated passive device (IPD) embedded in the interposer, the IPD including:
- a substrate;
- a first insulator layer disposed on the substrate;
- a multilevel wiring structure defined in the first insulator layer;
- and
- a plurality of passive devices electrically connected to the multilevel wiring structure.
8 more elements
An assembly comprising:
- an interposer having a plurality of wire traces, the wire traces extending from a first side to a second side of the interposer, the first and second sides of the interposer on opposing sides of the interposer;
- a processor chip disposed proximal to the first side of the interposer, the processor chip electrically connected to a first wire trace on the first side of the interposer;
- a plurality of solder bumps disposed between the processor chip and the first side of the interposer, the solder bumps forming a plurality of gaps between adjacent solder bumps;
- and
- an integrated passive device (IPD) mounted on the processor chip, the IPD disposed in the gap, the IPD including a substrate;
- a first insulator layer disposed on the substrate;
- a multilevel wiring structure defined in the first insulator layer;
- and
- a plurality of passive devices electrically connected to the multilevel wiring structure.
6 more elements
An assembly comprising:
- an interposer having a plurality of wire traces, the wire traces extending from a first side to a second side of the interposer, the first and second sides of the interposer on opposing sides of the interposer;
- and
- an integrated passive device (IPD) embedded in the interposer, the IPD including:
- a substrate;
- a first insulator layer disposed on the substrate;
- a multilevel wiring structure defined in the first insulator layer;
- and
- a plurality of passive devices electrically connected to the multilevel wiring structure.
5 more elements
Dependencies are inferred from the claim text.