Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board

2:

• The substrate for a printed circuit board according to claim 1, wherein the transition metal in group 10 comprises nickel or palladium.

3:

• The substrate for a printed circuit board according to claim 1, wherein the portion where the transition metal in group 10 is present includes a region having an average thickness of 500 nm and extending from an interface with the metal layer.

4:

• The substrate for a printed circuit board according to claim 3, wherein the transition metal in group 10 is present also in the metal layer, and
• content of the transition metal in group 10 in the region is higher than content of the transition metal in group 10 in the metal layer.

5:

• The substrate for a printed circuit board according to claim 3, wherein content of the transition metal in group 10 in the region is quantitatively determined by EDX and found to be 1% or more by mass.

7:

• A printed circuit board comprising a conductive pattern,
• wherein the conductive pattern is formed by subjecting the metal layer of the substrate for a printed circuit board according to claim 1 to a subtractive process or a semi-additive process.