Method for producing printed wiring board

A method for producing a printed wiring board, comprising:

• (A) preparing an adhesive sheet comprising a support and a resin composition layer provided on said support;
• (B) laminating said adhesive sheet on an internal layer substrate so that said resin composition layer is in contact with said internal layer substrate;
• and
• (C) thermally curing said adhesive sheet by heating from T1 (° C.) to T2 (° C.), to form an insulating layer, wherein
• the adhesive sheet is thermally cured so that a sum ((EAMD−EBMD)+(EATD−EBTD)) of a difference (EAMD−EBMD) between a maximum expansion rate EAMD (%) of the support in an MD direction during heating from T1 (° C.) to T2 (° C.) and an expansion rate EBMD (%) of the support at T2 (° C.) at the end of heating and a difference (EATD−EBTD) between a maximum expansion rate EATD (%) of the support in a TD direction during heating from T1 (° C.) to T2 (° C.) and an expansion rate EBTD (%) of the support at T2 (° C.) at the end of heating is 4 or less and a lowest melt viscosity of the resin composition layer at T1 (° C.) or higher is 4,000 poises or more.

A layered body, comprising:

• an internal layer substrate;
• an insulating layer provided on said internal layer substrate;
• and
• a support being in contact with said insulating layer, wherein
• variation in a thickness of the insulating layer is 1 μm or less in a region except for 5% of a dimension of the support from edge portions of the support.