Wiring board manufacturing method

A wiring board manufacturing method comprising:

• forming a conductor pattern in a first wiring layer of a waste board section of a wiring board including a product section and the waste board section and including a plurality of wiring layers in the product section and the waste board section, the conductor pattern including a slit in a zigzag pattern extending in a first direction;
• and
• forming a conductor pattern on a second wiring layer of the waste board section, the conductor pattern including a slit in a zigzag pattern shifted in the first direction with respect to the zigzag pattern of the slit in the first wiring layer and extending in the first direction.

A wiring board manufacturing method comprising:

• forming a conductor pattern in a first wiring layer of a waste board section of a wiring board including a product section and the waste board section and having a plurality of wiring layers in the product section and the waste board section, the conductor pattern including a first slit in a zigzag pattern extending in a first direction and a second slit in a zigzag pattern extending in a second direction crossing the first direction;
• and
• forming a conductor pattern in a second wiring layer of the waste board section, the conductor pattern including a third slit in a zigzag pattern shifted in the first direction with respect to the zigzag pattern of the first slit and extending in the first direction and a fourth slit in a zigzag pattern shifted in the second direction with respect to the zigzag pattern of the second slit and extending in the second direction.