High-frequency module
AssigneeMurata Manufacturing Co., Ltd.
InventorTakanori ITO
Life of this patent
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Abstract
A high-frequency module includes a multilayer substrate that includes an insulator layer and a wiring electrode, a component on one main surface of the multilayer substrate, a resin layer on the one main surface so as to cover the component, and a shield electrode covering at least a portion of a surface of the resin layer and at least a portion of a side surface of the multilayer substrate. The wiring electrode includes a capacitor via electrode that is spaced away from the shield electrode inside the multilayer substrate, and a first capacitor is defined by the shield electrode and the capacitor via electrode.
Claims16
A high-frequency module comprising:
- a multilayer substrate that includes an insulator layer and
- a wiring electrode;
- a component that is mounted on one main surface of the multilayer substrate;
- a resin layer that is provided on the one main surface to cover the component;
- and
- a shield electrode that is provided to cover at least a portion of a surface of the resin layer and at least a portion of a side surface of the multilayer substrate;
- wherein
- the wiring electrode includes a capacitor via electrode that is spaced away from the shield electrode inside the multilayer substrate;
- and
- a first capacitor is defined by the shield electrode and the capacitor via electrode.
Dependencies are inferred from the claim text.