US 2017/0290141 A1Published application

Conductive-layer-integrated flexible printed circuit board

AssigneeKaneka Corporation

InventorsMasayoshi Kido, Yoshihide Sekito

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Abstract

The present invention provides a conductive-layer-integrated flexible printed circuit board that has excellent electrical insulation reliability and that prevents the electrically conductive layer from being detached during a reflow process. The conductive-layer-integrated flexible printed circuit board includes: (A) an electromagnetic-shielding conductive layer; (B) an insulator film; and (C) a wiring-pattern-equipped film, (A) the electromagnetic-shielding conductive layer, (B) the insulator film, and (C) the wiring-pattern-equipped film being laminated in this order, (B) the insulator film containing at least (a) a binder polymer and (b) a black coloring agent having a reflective range within the infrared range.

Claims6

Dependent claims

A conductive-layer-integrated flexible printed circuit board, comprising:

(A) an electromagnetic-shielding conductive layer;
(B) an insulator film;
and
(C) a wiring-pattern-equipped film,
(A) the electromagnetic-shielding conductive layer, (B) the insulator film, and (C) the wiring-pattern-equipped film being laminated in this order,
(B) the insulator film having a thickness of from 5 μm to 100 μm containing at least (a) a binder polymer and (b) a black coloring agent containing a metal complex oxide or an organic pigment and having a reflectance of 5% or higher in a reflective range within an infrared range,
wherein (B) the insulator film contains (c) a flame retarder that is substantially undissolvable in an organic solvent, the flame retarder being selected from at least one member of the group consisting of phosphinate, a melamine cyanurate, and a boehmite aluminum hydroxide,
and wherein (A) the electromagnetic-shielding conductive layer is (A-1) a film, (A-2) a paste, or (A-3) a thin metal film.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application: 15/629,504Filed 21 Jun 2017
Priority: JP 2012-15993918 Jul 2012
Published: 5 Oct 2017
Term ends: Not estimatedThe source records don’t support an estimate.

Classification11 codes

H05K 1/0216
Electrical arrangements not otherwise provided for: reduction of cross-talk, noise or electromagnetic interference
C09D 5/004
Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced ; Filling pastes:…
G03F 7/027
Photosensitive materials: non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
H05K 1/028
Bendability or stretchability details: bending or folding regions of flexible printed circuits

Family

Application14/414,846Division · filed 14 Jan 2015
Application15/629,504Division
US 10,045,433 B2Related patent
US 2015/0195899 A1Published application
US 9,723,708 B2Related patent
US 2017/0290141 A1This patent

From the US filing history. Foreign family members aren’t listed.

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