US 2017/0290138 A1 · PRINTED CIRCUIT BOARD

Abstract

A printed circuit board has a copper clad laminate and a plurality of holes. The copper clad laminate for dissipating heats generated from a chip when the chip operates has a plurality of solder paste disposed areas. The plurality of holes situate on the copper clad laminate and each of the holes does not communicate with others, wherein the plurality of holes are nonconductors. Each of the solder paste disposed areas is surrounded by the plurality of holes and each solder paste disposed areas is surrounded by at least two holes.

Claims13

Dependent claims

A printed circuit board, for being mounted to a chip, the printed circuit board comprising:

a copper clad laminate, used for dissipating heats generated from a chip, the copper clad laminate comprising a plurality of solder paste disposed areas;
and
a plurality of holes, which situate on the copper clad laminate, each of the holes does not communicate with others, wherein the plurality of holes are nonconductors, the plurality of solder paste disposed areas being surrounded by the plurality of holes, and each of the solder paste disposed areas being surrounded by at least two holes.

Dependencies are inferred from the claim text.

Facts

Application

15/437,470Filed 21 Feb 2017

Priority

TW 10511040231 Mar 2016

Published

5 Oct 2017

Term ends

Not estimatedThe source records don’t support an estimate.

Classification5 codes

H05K 1/0209
Cooling of mounted components: external configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
H05K 3/3436
Leadless components: having an array of bottom contacts, e.g. pad grid array or ball grid array components
H05K 2201/0969
Covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095: apertured conductors
H05K 2201/10969
Other details of electrical connections: metallic case or integral heatsink of component electrically connected to a pad on PCB

Printed circuit board

Life of this patent

Printed circuit board

Life of this patent

Abstract

Claims13