Lc filter layer stacking by layer transfer to make 3d multiplexer structures

A three dimensional (3D) stacked multiplexer structure, comprising:

• a first two dimensional (2D) inductor capacitor (LC) filter circuit including a 2D spiral inductor and at least one first means for storing charge;
• and
• a second 2D LC filter circuit including a second 2D spiral inductor and at least one second means for storing charge, the second 2D LC filter circuit stacked directly on and communicably coupled to the first 2D LC filter circuit.

A radio frequency (RF) front end module, comprising:

• a three dimensional (3D) stacked multiplexer structure, comprising a first two dimensional (2D) inductor capacitor (LC) filter circuit including a first 2D spiral inductor and at least one first capacitor, and a second 2D LC filter circuit including a second 2D spiral inductor and at least one second capacitor, the second 2D LC filter circuit stacked directly on and communicably coupled to the first 2D LC filter circuit;
• and
• an antenna coupled to an output of the 3D stacked multiplexer structure.