Oven controlled crystal oscillator device cover
AssigneeCiena Corporation
InventorsKevin Estabrooks, Daniel Rivaud, Adrianus Van Gaal
Life of this patent
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Abstract
A device cover for temperature control of a component device includes at least one heating element enclosed using the device cover, and multiple sections. Each section is located at a distinct location on the device cover and includes a reflection angle for the distinct location. The reflection angle is configured to reflect heat to the component device enclosed using the device cover, the heat originating from the at least one heating element.
Claims20
A device cover for temperature control of a component device, comprising:
- at least one heating element enclosed using the device cover;
- and
- a plurality of sections, each section of the plurality of sections located at a distinct location on the device cover and comprising a reflection angle for the distinct location, the reflection angle being configured to reflect heat to the component device enclosed using the device cover, the heat originating from the at least one heating element.
An electro/opto-mechanical assembly for temperature control of a component device, comprising:
- at least one heating element in proximity of the component device;
- and
- a device cover having a plurality of sections, each section of the plurality of sections located at a distinct location on the device cover and comprising a reflection angle for the distinct location, the reflection angle being configured to reflect heat to the component device enclosed using the device cover, the heat originating from the at least one heating element enclosed using the device cover.
A method for temperature control of a component device, comprising:
- providing a device cover having a plurality of sections, each section of the plurality of sections located at a distinct location on the device cover and comprising a reflection angle for the distinct location, the reflection angle being configured to reflect heat to the component device enclosed using the device cover, the heat originating from at least one heating element enclosed using the device cover;
- and
- mounting, on a substrate, the device cover, the component device, and the at least one heating element.
Dependencies are inferred from the claim text.