Acoustic wave device and method for manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSeung Wook PARK, Tae Sung JEONG, No Il PARK
Life of this patent
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Abstract
An acoustic wave device includes: a substrate; an acoustic wave generating part disposed on a surface of the substrate; a ground pad disposed on the surface of the substrate; a support part spaced apart from the acoustic wave generating part on the surface of the substrate; a shielding member disposed on the support part, and spaced apart from the acoustic wave generating part; and a ground terminal disposed on the ground pad, wherein the ground pad and the shielding member are electrically connected to each other through the ground terminal.
Claims17
An acoustic wave device comprising:
- a substrate;
- an acoustic wave generating part disposed on a surface of the substrate;
- a ground pad disposed on the surface of the substrate;
- a support part spaced apart from the acoustic wave generating part on the surface of the substrate;
- a shielding member disposed on the support part, and spaced apart from the acoustic wave generating part;
- and
- a ground terminal disposed on the ground pad,
- wherein the ground pad and the shielding member are electrically connected to each other through the ground terminal.
A method to manufacture an acoustic wave device, the method comprising:
- forming an acoustic wave generating part and a ground pad on a surface of a substrate;
- forming a support part to be spaced apart from the acoustic wave generating part on the surface of the substrate;
- disposing a shielding member on the support part;
- and
- attaching a ground terminal to the ground pad and the shielding member.
A method to manufacture an acoustic wave device, the method comprising:
- forming an acoustic wave generating part and a ground pad on a surface of a substrate;
- forming a connection conductor having a pillar form on the ground pad;
- forming a support part to be spaced apart from the acoustic wave generating part on the surface of the substrate;
- disposing a shielding member on the support part and connecting the shielding member to the connection conductor;
- and
- forming a terminal part at an end of the connection conductor.
Dependencies are inferred from the claim text.