Piezoelectric package-integrated contour mode filter devices

A package substrate comprising:

• a plurality of organic dielectric layers and a plurality of conductive layers to form the package substrate;
• a cavity formed in the package substrate;
• and
• a piezoelectric device integrated within the package substrate, the piezoelectric device including an input electrode, an output electrode, and a ground electrode in contact with a piezoelectric material, wherein the piezoelectric device oscillates in response to application of an input electrical signal between the input and ground electrodes.

A filtering device comprising:

• an input electrode for receiving an input electrical signal;
• a first piezoelectric layer in contact with the input electrode;
• a ground electrode in contact with the first piezoelectric layer;
• a second piezoelectric layer in contact with the ground electrode;
• and
• an output electrode in contact with the second piezoelectric layer, wherein the filtering device oscillates within an organic substrate in response to application of the input electrical signal between the input electrode and ground electrode.