Piezoelectric package-integrated crystal devices

A package substrate comprising:

• a plurality of organic dielectric layers and a plurality of conductive layers to form the package substrate;
• a cavity formed in the package substrate;
• and
• a piezoelectric device integrated within the package substrate, the piezoelectric device includes an input transducer, a vibrating structure coupled to the input transducer, and an output transducer coupled to the vibrating structure, wherein in operation a first piezoelectric material of the input transducer causes an input electrical signal to be converted into mechanical vibrations which propagate across the vibrating structure to the output transducer.

A resonator comprising:

• an input transducer that includes first and second electrodes and a first piezoelectric material;
• a vibrating structure coupled to the input transducer, the vibrating structure positioned above a cavity within an organic substrate;
• and
• an output transducer coupled to the vibrating structure, the output transducer includes first and second electrodes and a second piezoelectric material, wherein in operation the input transducer causes an input electrical signal to be converted into mechanical vibrations which propagate across the vibrating structure to the output transducer.