Electronic package including cavity formed by removal of sacrificial material from within a cap

A method of manufacturing an electronic device, the method comprising:

• preparing an electronic component by forming a sacrificial layer covering a functional unit formed on a main surface of a first substrate;
• forming a cap layer covering the sacrificial layer;
• forming holes through the cap layer;
• forming a cavity by removing the sacrificial layer using a wet etching process through the holes, the holes including a peripheral hole communicating an inside of the cavity with an outside of the cavity along the main surface on the periphery, the cap layer forming a periphery enclosing the cavity on the main surface;
• forming a second resin layer covering the cap layer and the main surface;
• and
• mounting the electronic component to a second substrate to form the electronic device.

An electronic component comprising:

• a substrate including a main surface on which a functional unit is formed;
• a cap layer defining a cavity enclosing and covering the functional unit, the cap layer forming a periphery enclosing the cavity on the main surface, the cap layer being provided with holes, the holes including peripheral holes communicating the cavity with an outside along the main surface on the periphery;
• and
• a resin layer covering the cap layer and the main surface.

An electronic device comprising:

• a first substrate;
• an electronic component including a second substrate having a main surface on which a functional unit is formed, a cap layer defining a cavity enclosing and covering the functional unit, and a first resin layer covering the cap layer and the main surface, the cap layer forming a periphery enclosing the cavity on the main surface, the cap layer being provided with holes, the holes including a peripheral hole communicating an inside of the cavity with an outside of the cavity along the main surface on the periphery;
• and
• a second resin layer sealing the first substrate and the electronic component.