Self-powered piezoelectric energy harvesting microsystem

A self-powered piezoelectric energy harvesting microsystem device, comprising:

• integrated circuit elements located at a central portion of a die region of a semiconductor wafer substrate;
• contacts and interconnections for the integrated circuit elements formed by metal layers over the central portion of the die region;
• piezoelectric energy harvesting unit components connected to the integrated circuit elements formed by first electrode, piezoelectric material and second electrode layers at a beam portion of the die region;
• and
• a battery provided on the central portion connected to the integrated circuit elements;
• wherein the die region includes a gap between a support frame portion and the central portion at least partially along at least 2 sides of the central portion and the beam portion has a thickness less than the central and support frame portions and joins a minority of the central portion to the support frame portion.

A self-powered piezoelectric energy harvesting microsystem device, comprising:

• integrated circuit elements located at a central portion of a die region of a semiconductor wafer substrate;
• contacts and interconnections for the integrated circuit elements formed by metal layers over the central portion of the die region;
• piezoelectric energy harvesting unit components connected to the integrated circuit elements, the piezoelectric energy harvesting unit comprising a first electrode, a piezoelectric material layer, and a second electrode at a beam portion of the die region;
• and
• a battery provided on the central portion connected to the integrated circuit elements;
• wherein:
• the die region includes a gap between a support frame portion and the central portion along first, second, and third sides of the central portion;
• the beam portion has a thickness less than the central and support frame portions and joins the central portion to the support frame portion on a fourth side of the central portion;
• and
• integrated circuit elements are provided at a first region of the central portion;
• and the battery is provided at a second region of the central portion laterally spaced from the first region.