Pre-encapsulated lead frames for microelectronic device packages, and associated methods
AssigneeMicron Technology, Inc.
InventorsAi Chie Wang, Choon Kuan Lee, Chin Hui Chong, Wuu Yean Tay
Life of this patent
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Abstract
Pre-encapsulated lead frames suitable for use in microelectronic device packages are disclosed. Individual lead frames can include a set of multiple lead fingers arranged side by side with neighboring lead fingers spaced apart from each other by a corresponding gap. An encapsulating compound at least partially encapsulates the set of lead fingers without encapsulating a microelectronic device. The encapsulating compound can generally fill the plurality of gaps between two adjacent lead fingers.
Claims20
A lead frame assembly, comprising:
- a first set of lead fingers arranged side by side with neighboring lead fingers spaced apart from each other by a corresponding gap;
- a second set of lead fingers arranged side by side, wherein the second set of lead fingers is spaced apart from the first set of lead fingers in a lengthwise direction by a space;
- an encapsulating compound at least partially encapsulating the set of lead fingers without encapsulating a microelectronic device, wherein the encapsulating compound generally fills the gaps between neighboring lead fingers and the space between the first and second sets of lead fingers;
- and
- a die paddle spaced apart from the first and second sets of lead fingers in the lengthwise direction, the die paddle being offset from a plane that includes the first and second sets of lead fingers.
A lead frame assembly, comprising:
- a first set of lead fingers arranged side by side with neighboring lead fingers spaced apart from each other by a corresponding gap;
- a second set of lead fingers spaced apart from the first set of lead fingers in a lengthwise direction by a space, wherein the first and second sets of lead fingers are in a first plane;
- a third set of lead fingers located in a second plane offset from the first plane;
- and
- an encapsulating compound at least partially encapsulating the first set of lead fingers without encapsulating a microelectronic device, wherein the encapsulating compound generally fills the gaps between neighboring lead fingers and the space between the first and second sets of lead fingers.
A microelectronic device package, comprising:
- a first set of lead fingers;
- a second set of lead fingers spaced apart from the first set of lead fingers;
- a lead frame between the first and second sets of lead fingers, the lead frame having a third set of lead fingers located between the first set of lead fingers and the second set of lead fingers, the lead frame further having an encapsulating compound at least partially encapsulating the third set of lead fingers;
- a microelectronic device having bond pads proximate to one edge of the lead frame;
- a first set of wirebonds electrically connecting the first set of lead fingers and the third set of lead fingers;
- a second set of wirebonds electrically connecting the bond pads and the third set of lead fingers;
- and
- a packaging material encapsulating the lead frame and the microelectronic device into a single package.
Dependencies are inferred from the claim text.