Thin Film Packaging Structure, Method For Fabrication Thereof And Display Device

Abstract

Embodiments of the disclosure provide a thin film packaging structure comprising a flexible thin film used for covering a device, wherein the flexible thin film comprises at least two organic film layers and at least one inorganic film layer, the at least two organic film layers comprises a first organic film layer and a second organic film layer, an inorganic film layer is provided between the first organic film layer and the second organic film layer, the first organic film layer contacts the device, and the second organic film layer is provided at an outermost layer of the flexible thin film. The thin film packaging structure according to embodiments of the disclosure can effectively prevent external oxygen and water from penetrating into the device and satisfy the packaging performance of the device.

Dependencies are inferred from the claim text.