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US 2017/0288152 A1Published application
Composition for forming organic semiconductor film, organic semiconductor film, manufacturing method thereof, organic semiconductor element, and manufacturing method thereof
AssigneeFUJIFILM Corporation
InventorsToshihiro KARIYA, Tetsu KITAMURA
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Abstract
A composition for forming an organic semiconductor film includes an organic semiconductor represented by Formula A-1, a polymer, a solvent having a boiling point of 150° C. or higher and an SP value of 18 to 23, and a silicone compound having a structure represented by Formula D-1.
Claims19
A composition for forming an organic semiconductor film, comprising:
- an organic semiconductor represented by Formula A-1;
- a polymer;
- a solvent having a boiling point of 150° C. or higher and an SP value of 18 to 23;
- and
- a silicone compound having a structure represented by Formula D-1,
- CmH2m+1-La1-T-La2-CnH2n+1 (A-1)
- wherein, in Formula A-1, T represents an aromatic hydrocarbon group or a hetero aromatic group which has a fused ring structure of three rings to seven rings, La1 and La2 each independently represent a single bond, a phenylene group, or a thienylene group, and m and n each independently represent an integer of 1 to 20, and m≠n, and
- wherein, in Formula D-1, Rd1 and Rd2 each independently represent a monovalent hydrocarbon group not including an ether bond.
5 more elements
Dependencies are inferred from the claim text.