Composition for forming organic semiconductor film and organic semiconductor element

A composition for forming an organic semiconductor film, comprising:

• an organic semiconductor represented by the following Formula A-1;
• and
• a solvent, which has a boiling point of equal to or higher than 150° C. and equal to or lower than 300° C. and an SP value of equal to or higher than 15.0 and equal to or lower than 18.0,
• wherein, in Formula A-1, T represents an aromatic hydrocarbon group having a ring-fused structure including 3 or more rings or a heteroaromatic group;
• L each independently represents a phenylene group or a thienylene group;
• Z each independently represents a group represented by the following Formula a-1;
• m each independently represents an integer of 0 to 4;
• n represents an integer of 1 to 8;
• and in a case where T does not have a ring-fused structure including 5 or more rings, m represents an integer of 1 to 4, and n represents an integer of 2 to 8,
• wherein, in Formula a-1, p represents an integer of 1 to 20, q represents an integer of 0 to 20, and * represents a binding position with respect to other structures.