Semiconductor device including an encapsulation material defining a through-hole
AssigneeInfineon Technologies AG
InventorsVolker Strutz, Klaus Elian, Cyrus Ghahremani, Rainer Markus Schaller
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Abstract
A semiconductor device includes a substrate, a semiconductor die attached to the substrate, and an encapsulation material. The semiconductor die includes a sensing element. The encapsulation material encapsulates the semiconductor die and a portion of the substrate. The encapsulation material defines a through-hole to receive a conductive element. The sensing element may include a magnetic field sensor to sense a magnetic field generated by the conductive element.
Claims20
A semiconductor device comprising:
- a substrate;
- a semiconductor die attached to the substrate, the semiconductor die comprising a sensing element;
- and
- an encapsulation material encapsulating the semiconductor die and a portion of the substrate, the encapsulation material defining a through-hole to receive a conductive element separate from the semiconductor device, the encapsulation material to galvanically isolate the conductive element from the semiconductor die,
- wherein the sensing element comprises a magnetic field sensor to sense a magnetic field generated by the conductive element.
(canceled)
A semiconductor device comprising:
- a leadframe;
- a semiconductor die attached to the leadframe, the semiconductor die comprising a magnetic field sensor;
- and
- an encapsulation material encapsulating the semiconductor die and a portion of the leadframe, the encapsulation material defining a first through-hole on a first side of the semiconductor die and a second through-hole on a second side of the semiconductor die opposite to the first side, the first through-hole and the second through-hole to receive a conductive element separate from the semiconductor device, the encapsulation material to galvanically isolate the conductive element from the semiconductor die,
- wherein the magnetic field sensor is to sense a magnetic field generated by the conductive element.
A method for fabricating a semiconductor device, the method comprising:
- attaching and connecting a semiconductor die to a leadframe, the semiconductor die comprising a sensor element;
- and
- encapsulating the semiconductor die and a portion of the leadframe with an encapsulation material such that a through-hole is defined through the encapsulation material, the through-hole to receive and position a conductor separate from the semiconductor die at a predefined distance from the sensor element, the encapsulation material to galvanically isolate the conductive element from the semiconductor die.
(canceled)
Dependencies are inferred from the claim text.